HPD series SiC MOSFET power module, circuit structure is Full Bridge. It integrates a high-performance SiC MOSFET chip and has a built-in temperature sensor. Especially suitable for electric vehicles, motor drives and other applications——Package size:W126.5*L154.5*H32 mm
Model | Categories | Package | Circuit structure | Block the voltage(V) | Rated current(A) | On-resistance(mΩ) | Tjmax(℃) |
---|---|---|---|---|---|---|---|
DFS02FB12HDB1 | SiC | HPD | Full Bridge | 1200 | 800 | - | 175 |
DFS03FB12HDB1 | SiC | HPD | Full Bridge | 1200 | 600 | - | 175 |
DFS04FB12HDB1 | SiC | HPD | Full Bridge | 1200 | 400 | - | 175 |
DFS02FB12HDW1 | SiC | HPD | Full Bridge | 1200 | 800 | - | 175 |
DFS03FB12HDW1 | SiC | HPD | Full Bridge | 1200 | 600 | - | 175 |
DFS04FB12HDW1 | SiC | HPD | Full Bridge | 1200 | 400 | - | 175 |