We are happy to announce that on January 25-27, 2023, Leapers Semiconductor Co., Ltd. will take part in the AUTOMOTIVE WORLD trade show. The event will take place at the Tokyo Big Sight, Japan.
AUTOMOTIVE WORLD is the world's leading exhibition for advanced automotive technologies including a series of conferences and events that cover vehicle electrification, autonomous driving, cybersecurity, etc.
During the show Leapers Semiconductor Co., Ltd. will present its latest technological solutions for the automotive industry including the SiC power devices for the EVs’ main inverters and auxiliary power systems.
To deliver the best-in-class performance, the advanced HPD and ED3S product families are produced using the patented Arcbonding™ technology. Unlike traditional Al wire bonding technology used by many manufacturers of automotive-grade power semiconductors, Arcbonding™ patented chip surface connecting technology ensures the reliability of SiC modules reach automotive application requirements, while significantly reducing parasitic resistance and parasitic inductance. Besides, Arcbonding™ proved to significantly reduce static losses, improve power cycling, and the ability of short time impulse current.
To learn more about Leapers Semiconductor Co., Ltd., our product roadmap, Arcbonding™, and the other technologies we use to deliver high performance SiC power modules for the automotive and other industries, we invite you to visit our booth 45B-51. Our team will be happy to support any of your projects.
