Digitalization, growth of cloud technologies, AI, ongoing pandemic, decarbonization plans, and global other trends set new standards, requirements, and challenges to power electronics industry, especially to end products like energy storage systems, solar inverter systems,air-compressor of full cell vehicle, electric motor drives, vehicle charging, etc.
Power semiconductors industry has always been the major drive force for power electronics. And with introduction of silicon carbide (SiC) as the successor of silicon (Si) it became possible for engineers to provide more compact, power efficient, highly reliable solutions using the new generation power modules.
A good example of such power modules is E0 series introduced by Leapers Semiconductor. E0 series are press fit SiC MOSFET power modules in a compact industry-recognized low inductive footprint.
To produce highly reliable E0 series SiC MOSFET power modules Leapers Semiconductor use high grade Si3N4 AMB substrates that combine best mechanical robustness with excellent heat dissipation properties featuring very high-power densities.
Unlike the competitors E0 modules feature epoxy resin instead of silicon leading to 3x and higher power and thermal cycling characteristics. Besides, all E0 SiC modules provide best in class low switching losses.
You can learn more about E0 series SiC power modules during PCIM Europe at our booth 520 in hall 7. We look forward to meeting you in Nuremberg this May.