HPD series SiC MOSFET power module, circuit structure is Full Bridge. It integrates a high-performance SiC MOSFET chip and has a built-in temperature sensor. Especially suitable for electric vehicles, motor drives and other applications——Package size：W126.5*L154.5*H32 mm
| Part Number | Type | Package | Circuit Diagram | Blocking Voltage（V） | Current（A） | RDs(on)（mΩ） | Tjmax（℃） |
|---|---|---|---|---|---|---|---|
| DFS01FB08HDB2S | SiC | HPD SiC | 3-Phase | 750 | 800 | 1.6 | 175 |
| DFS01FB12HDB2S | SiC | HPD SiC | 3-Phase | 1200 | 800 | 1.6 | 175 |
| DFS02FB12HDB2S | SiC | HPD SiC | 3-Phase | 1200 | 600 | 2.1 | 175 |
| DFS03FB12HDB2S | SiC | HPD SiC | 3-Phase | 1200 | 400 | 3.2 | 175 |
| DFS02FB12HDA1S | SiC | HPD SiC | 3-Phase | 1200 | 600 | 2.5 | 175 |
| DFS02FB14HDA1S | SiC | HPD SiC | 3-Phase | 1400 | 800 | 2.5 | 175 |
| DFS03FB14HDA1S | SiC | HPD SiC | 3-Phase | 1400 | 600 | 3.2 | 175 |
